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advanced fabrication technologies for ic manufacturing


Posted by:
Created at: Tuesday 30th of October 2012 05:00:02 AM
Last Edited Or Replied at :Tuesday 30th of October 2012 05:00:02 AM
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advanced..................[:=> Show Contents <=:]



additive manufacturing ppt


Posted by:
Created at: Monday 01st of October 2012 12:25:39 PM
Last Edited Or Replied at :Monday 01st of October 2012 12:25:39 PM
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machines i..................[:=> Show Contents <=:]



Laser micro fabrication technologies on RF MEMS


Posted by: seminar paper
Created at: Thursday 15th of March 2012 04:18:54 AM
Last Edited Or Replied at :Thursday 15th of March 2012 04:18:54 AM
micro fabrication in mems seminar topic , mems fabrication,

Radio Frequency Microelectromechanical Systems Switches (RF MEMS)
Lower insertion loss
High isolation
Greater linearity
Lower static power dissipation

RF MEMS Switch Structure


Substrate
Coplanar waveguide(CPW) signal line
Bridge
Electrode plate

Fabrication based on IC wet and dry etching technique


Fabrication Procedure


Oxidation of SiO2 and deposition of SiN on Si substrate
Formation of signal line and ground electrode
SiN/Ta2O5 double dielectric films on signal line
Vaporizing Al layer and wet etching
Polymide coating to achieve sacrificial l..................[:=> Show Contents <=:]



Industrial Applications


Posted by: seminar paper
Created at: Saturday 25th of February 2012 03:24:13 AM
Last Edited Or Replied at :Saturday 25th of February 2012 03:24:13 AM
past present and future of industrial robotics, deburring ppt , general seminar topics, robotic applications electronic manufacturing seminar , sample seminar discussion list of paint products,
, planning, manufacturing, distribution, and management.
Automation Technologies:
Numerical Control(NC): capability of flexibility of operations, low cost, and ease of making different parts with lower operator skill.
Adaptive Control(AC): Continuously monitor the operation and make necessary adjustments in process parameters.


Industrial Applications(contd.)


Industrial Robot Applications can be divided into:
Material-handling applications:
Involve the movement of material or parts from one location to another.
It include part placement, palletizing and/or depalletizing,..................[:=> Show Contents <=:]



3d ic technology


Posted by: cdpoint
Created at: Saturday 09th of July 2011 04:56:20 AM
Last Edited Or Replied at :Saturday 09th of July 2011 04:56:20 AM
semiconductor package , semiconductor package3d ic, integrated circuit technology , 3d chip technology, 3d interconnect , advantages of ic technology, ic manufacturing process , semiconductor integrated circuit, integrated circuit ic , integrated circuit design, semiconductor industry , 3d ics, ic packages , integrated circuit, 3d integration , 3d ic, 3d ic technology , technology, 3d ic , 3d ic technology seminars withppt and documentation, 3d ics seminor documentation , free 3d ics seminor documentation, 3d ic seminor topic documentation , 3d ic technology ppt, 3d ic seminar , 3d ic technology, seminar on ic technology , 3d ic technology documentation, 3d ic technology seminar , documentation of 3d ic technology, 3d ic seminar report , ppt on 3d ic technology, documentation on 3d ic technology ,
..................[:=> Show Contents <=:]



PRINTED CIRCUIT BOARDSCOIL WINDING AND CABLES


Posted by: smart paper boy
Created at: Saturday 09th of July 2011 01:40:03 AM
Last Edited Or Replied at :Saturday 09th of July 2011 01:40:03 AM
printed circuit board coil winding, vasantha electronic manufacturing services , automatic coil winding machine,
hed setup for manufacturing highly reliable wiring harness based on customer requirements.
The Engineering Capabilities for Wiring Harness In -House capability to process different typ..................[:=> Show Contents <=:]



strategy for optimizing manufacturing operations full report


Posted by: project report tiger
Created at: Wednesday 17th of February 2010 03:42:59 AM
Last Edited Or Replied at :Wednesday 17th of February 2010 03:42:59 AM
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e been minimized. Availability numbers are next highest, averaging 87%. The principal production controlled factors contributing to lost availability are unscheduled maintenance and scheduled maintenance. Key activities for minimizing unscheduled maintenance are the implementation of preventive maintenance and equipment reliability programs. Increasing run speed efficiency would increase throughput but would adversely affect product quality, contributing to even lower yield numbers. Owing to the apparent dependency often observed between these two metrics, optimizing %yield allows for the deve..................[:=> Show Contents <=:]



3- D ICs


Posted by: Computer Science Clay
Created at: Sunday 01st of March 2009 02:46:01 AM
Last Edited Or Replied at :Sunday 01st of March 2009 02:46:01 AM
thermal aware 3d ic placement via transformation, 3d ic packaging design , 3d ic power analysis, 3d ic package , 3d ic layout view, 3d ic ppt , 3d ic packaging, 3d ic ieee , 3d ic market, 3d ic manufacturing , 3d ic integration, 3d ic georgia tech , 3d ic design architecture workshop, 3d ic conference , 3d ic applications, 3d ic design , 3D IC,
rful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wire pitch and increasing die size. Additionally, heterogeneous integration of different technologies on one single chip is becoming increasingly desirable, for which planar (2-D) ICs may not be suitable.

The three dimensional (3-D) chip design strategy exploits the vertical dimension to alleviate the interconnect related problems and to facilitate heterogeneous integration of technologies to realize system on a chip (SoC) desig..................[:=> Show Contents <=:]



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