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Title: 3D Stacking EDA Challenges Opportunities
Page Link: 3D Stacking EDA Challenges Opportunities -
Posted By: project report helper
Created at: Tuesday 19th of October 2010 11:42:17 PM
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3D Stacking: EDA Challenges & Opportunities



SEMATECH SymposiumTokyo, Japan
Rajiv MaheshwarySenior Director



Summary

3D IC Market Drivers
–Cost, Performance/Power
–Heterogeneous integration
•Customers expected to have production devices starting 2011
–Logic + DRAM and Logic + Logic
–$20B* TSV devices by 2013
•Synopsys Focus
–Enable design flow with partners
–Lead definition of emerging interoperability standards ....etc

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Title: organic thin film transistors full report
Page Link: organic thin film transistors full report -
Posted By: project reporter
Created at: Monday 01st of February 2010 03:16:59 AM
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Abstract
Organic thin-film transistors OTFTs have received considerable attention recently because they can be fabricated at reduced temperature and potentially reduced cost compared to hydrogenated amorphous silicon thin-film transistors. Low fabrication temperature allows a wide range of substrate possibilities and makes OTFTs an attractive technology for many low-cost electronics applications, particularly those that require or may benefit from flexible polymeric substrates such as rf identification tags, smart cards ....etc

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Title: elastic quotas seminar report
Page Link: elastic quotas seminar report -
Posted By: applied electronics
Created at: Tuesday 29th of December 2009 03:56:09 AM
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Chapter 1. 1.Introduction
Despite seemingly endless increases in the amount of storage
and ever decreasing costs of hardware, managing storage is
still expensive. Additionally, users continue to fill increasingly
larger disks, worsened by the proliferation of large multimedia
files and high-speed broadband networks. Storage requirements
are continuing to grow at a rate of 50% a year. Worse, existing
hard disk technology is reaching physical limitations, making it
harder and costlier to meet growing user demands .
Stor ....etc

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Title: Dynamic resource sharing protection using label stacking and burst multiplexing in op
Page Link: Dynamic resource sharing protection using label stacking and burst multiplexing in op -
Posted By: projectsofme
Created at: Tuesday 12th of October 2010 01:48:42 AM
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Dynamic resource sharing protection
using label stacking and burst multiplexing
in optical burst switched networks



Abstract: A protection and restoration mechanism is essential to provide reliable traffic transmission in networks, but it is not easy to apply existing protection mechanisms to optical burst-switching (OBS) networks, because of the unique properties of OBS. The authors introduce a 1:1 link-based protection ....etc

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Title: Polymer Memory full report
Page Link: Polymer Memory full report -
Posted By: computer science technology
Created at: Wednesday 20th of January 2010 12:12:16 PM
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ABSTRACT
Digital Memory is and has been a close comrade of each and every technical advancement in Information Technology. The current memory technologies have a lot of limitations. These memory technologies when needed to expand will allow expansion only two dimensional space. Hence area required will be increased.
Next Generation Memories satisfy all of the good attributes of memory. The most important one among them is their ability to support expansion in three dimensional spaces. They include MRAM, FeRAM, Polymer Me ....etc

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Title: VISUAL CRYPTOGRAPHY
Page Link: VISUAL CRYPTOGRAPHY -
Posted By: project topics
Created at: Monday 12th of April 2010 10:39:20 AM
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Abstract

Visual cryptography is a popular solution for image encryption. Using secret sharing concepts, the encryption procedure encrypts a secret image into the so-called shares which are noise-like secure images which can be transmitted or distributed over an untrusted communication channel. Using the properties of the human visual system to force the recognition of a secret message from overlapping shares, the secret image is decrypted without additional computations and any knowledge of cryptography.

Visual cryptographic solutions ope ....etc

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Title: composite materials used in ansys tutorial
Page Link: composite materials used in ansys tutorial -
Posted By: Guest
Created at: Tuesday 09th of February 2016 08:21:33 PM
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Title: 3d ics
Page Link: 3d ics -
Posted By: computer science crazy
Created at: Sunday 27th of December 2009 11:35:52 PM
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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wi ....etc

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Title: polymer memory Download Full Report And Abstract
Page Link: polymer memory Download Full Report And Abstract -
Posted By: computer science crazy
Created at: Saturday 21st of February 2009 02:06:44 PM
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1. INTRODUCTION
Imagine a time when your mobile will be your virtual assistant and will need far more than the 8k and 16k memory that it has today, or a world where laptops require gigabytes of memory because of the impact of convergence on the very nature of computing. How much space would your laptop need to carry all that memory capacity? Not much, if Intel's project with Thin Film Electronics ASA (TFE) of Sweden works according to plan. TFE's idea is to use polymer memory modules rather than silicon-based memory modules, and what's more it ....etc

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Title: Micro-electro Mechanical Systems MEMS
Page Link: Micro-electro Mechanical Systems MEMS -
Posted By: computer science crazy
Created at: Sunday 15th of February 2009 01:23:59 AM
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Micro-electro Mechanical Systems (MEMS)

Introduction
The satellite industry could experience its biggest revolution since it joined the ranks of commerce, thanks to some of the smallest machines in existence. Researchers are performing experiments designed to convince the aerospace industry that microelectromechanical systems (MEMS) could open the door to low-cost, high-reliability, mass-produced satellites.MEMS combine conventional semiconductor electronics with beams, gears, levers, switches, accelerometers, diaphragms, microfluidic thrus ....etc

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Title: MEMS in space
Page Link: MEMS in space -
Posted By: computer science crazy
Created at: Monday 23rd of February 2009 12:49:15 PM
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The satellite industry could experience its biggest revolution since it joined the ranks of commerce, thanks to some of the smallest machines in existence. Researchers are performing experiments designed to convince the aerospace industry that microelectromechanical systems (MEMS) could open the door to low-cost, high-reliability, mass-produced satellites. MEMS combine conventional semiconductor electronics with beams, gears, levers, switches, accelerometers, diaphragms, microfluidic thrusters, and heat controllers, all of them microscopic in s ....etc

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Title: Dynamic resource sharing protection using label stacking and burst multiplexing in op
Page Link: Dynamic resource sharing protection using label stacking and burst multiplexing in op -
Posted By: projectsofme
Created at: Tuesday 12th of October 2010 01:48:42 AM
resource and research, 3d stacking puzzles, multiprotocol label switching seminar, sharing of media by multiplexing, multiprotocol label switching configuration guide, dynamic resource allocatin, rpi 3d stacking,
Dynamic resource sharing protection
using label stacking and burst multiplexing
in optical burst switched networks



Abstract: A protection and restoration mechanism is essential to provide reliable traffic transmission in networks, but it is not easy to apply existing protection mechanisms to optical burst-switching (OBS) networks, because of the unique properties of OBS. The authors introduce a 1:1 link-based protection ....etc

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